| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip size package type semiconductor device and an inexpensive semiconductor device in which an expensive manufacturing facility is not required and time required for manufacture is shortened as well. <P>SOLUTION: A heat resistant adhesive tape 6 is slit to leave an adhesive surface in accordance with a position to form an Al electrode pad 2 on a semiconductor wafer 1, a packaging terminal 5 is adhered on the adhesive surface, and the packaging terminal 5 is coated with a solder 8. A barrier metal formed in advance is aligned with the packaging terminal 5 to face each other, the semiconductor wafer 1 is placed thereon to contact the solder 8 and the barrier metal 4 and put into a reflow furnace to dissolve the solder 8, and the packaging terminal 5 and the barrier metal 4 are soldered. Thus, a Cu post required for a conventional semiconductor device is not required, an expensive sputtering apparatus required for formation is not needed, and sputtering time required long is not required at all. <P>COPYRIGHT: (C)2004,JPO</p> |
