| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device free from flaws such as a warped substrate or an inclined cover, high in producibility, low in cost, and small in size. SOLUTION: The optical semiconductor device comprises a substrate 1 made of a dielectric body on whose upper main surface a mount 1a for an optical semiconductor element 2 is provided, with the mount 1a surrounded with an electrode pad 6; a frame 3 bonded with a UV-setting resin adhesive 9 to the periphery of the upper main surface of the substrate 1 and arranged to surround the mount 1a; the optical semiconductor element 2 having a light receiving section 2a at the middle of its upper surface and an electrode 7 on its periphery, with its lower surface bonded and fixed to the mount 1a and with the electrode 7 electrically connected to the electrode pad 6 with a bonding wire 8; and a translucent cover 4 bonded by a UV-setting sealing agent 10 to the upper surface of the frame 3. The frame 3 and the translucent cover 4 are built of a dielectric body capable of transmitting 70% or more of 100-450 nm UV rays. COPYRIGHT: (C)2004,JPO |
