发明名称 Molded eddy current array probe
摘要 The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.
申请公布号 US2004056656(A1) 申请公布日期 2004.03.25
申请号 US20020253848 申请日期 2002.09.24
申请人 GENERAL ELECTRIC COMPANY 发明人 MCKNIGHT WILLIAM STEWART;NATH SHRIDHAR CHAMPAKNATH;GRESHAM SANDIE ELIZABETH;TRANTOW RICHARD LLOYD;INGRAM DOUGLAS EDWARD;ERTEL JOHN WILLIAM;BATZINGER THOMAS JAMES;ROSE CURTIS WAYNE;LITTLE FRANCIS HOWARD
分类号 G01B7/34;G01B7/00;G01N27/90;(IPC1-7):G01N27/82;G01R33/00 主分类号 G01B7/34
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