发明名称 |
Molded eddy current array probe |
摘要 |
The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.
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申请公布号 |
US2004056656(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20020253848 |
申请日期 |
2002.09.24 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
MCKNIGHT WILLIAM STEWART;NATH SHRIDHAR CHAMPAKNATH;GRESHAM SANDIE ELIZABETH;TRANTOW RICHARD LLOYD;INGRAM DOUGLAS EDWARD;ERTEL JOHN WILLIAM;BATZINGER THOMAS JAMES;ROSE CURTIS WAYNE;LITTLE FRANCIS HOWARD |
分类号 |
G01B7/34;G01B7/00;G01N27/90;(IPC1-7):G01N27/82;G01R33/00 |
主分类号 |
G01B7/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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