发明名称 Chip seal method with heating step
摘要 A paving method is provided that includes applying a thermoplastic material to a surface to be paved, covering the thermoplastic material with a layer of aggregate (precoated or otherwise), passing a heater above the aggregate and thermoplastic material, and at least partially embedding the aggregate in the thermoplastic material.
申请公布号 US2004057794(A1) 申请公布日期 2004.03.25
申请号 US20020253304 申请日期 2002.09.24
申请人 CORCORAN JOHN 发明人 CORCORAN JOHN
分类号 E01C23/14;(IPC1-7):E01C23/14 主分类号 E01C23/14
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