| 摘要 |
A polishing pad (for example, polishing pad (305)) for use in planarization of a semiconductor wafer (for example, semiconductor wafer (420)), the polishing pad (305) featuring a plurality of different polishing surfaces, depending upon the direction of the movement of the polishing pad (305). The polishing pad (305) may take the form of a polishing disc or a polishing belt. The planarization of the semiconductor wafer (420) can then take place at a fewer number of polishing stations, thereby reducing the amount of time needed and reducing the probability of damage to the semiconductor wafer (420). |
