发明名称 SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To improve mechanical strength surrounding through conductors and to secure insulation between a laminated capacitor and a land. <P>SOLUTION: The substrate is provided with a first through conductor 10a formed from a wire conductor 5 to an electrode pad 11 through the laminated capacitor 7 inside a base body 1, and a second through conductor 10b for connecting the inner layer power source conductor layers with each other or inner layer ground conductor layers with each other of the laminated capacitor part 7. The first and the second through conductors 10a and 10b are provided with a land 12 consisting of a conductor layer independent from the inner layer power source conductor layers or the inner layer ground conductor layers, by a conductor non-forming part 13 coaxially surrounding a site of passing through the inner layer power source conductor layers or the inner layer ground conductor layers or connected to them; and an auxiliary conductor layer 14 opposing the land 12 and the conductor non-forming part 13 at a site of passing through adjacent inner layer power source conductor layers, or inner layer ground conductor layers or connected to them. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004095734(A) 申请公布日期 2004.03.25
申请号 JP20020253000 申请日期 2002.08.30
申请人 KYOCERA CORP 发明人 IMURA RYUICHI;OTA NAOTAKA
分类号 H05K3/46;H01L23/12;(IPC1-7):H01L23/12 主分类号 H05K3/46
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