| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a communication apparatus which is easy to manufacture and is capable of high density packaging, and which is further applicable even to a thin substrate difficult in fixing a metal case thereto at a side surface and an end surface, and to which a metal case can be joined without subjecting a side surface of the substrate and an end surface of the same to a metallizing processing, and further provide a communication apparatus using it. <P>SOLUTION: Soldering terminals 14a to 14d are provided at four corners of a metal case 14, and solder lands 12a to 12d corresponding to an electronic component mounting surface of a substrate 12 are provided, whereby the metal case 14 is soldered to the substrate 12. Further, the soldering terminals 14a to 14d are folded, and the folded soldering terminals 14e, 14f are provided also at a central portion of a side surface of the metal case 14, whereby a folding direction of at least one or more of the soldering terminals is changed. The thermal expansibility of the metal case 14 is reduced lower than the substrate 12, and a difference between both thermal expansibilities is set to 5 ppm or less. <P>COPYRIGHT: (C)2004,JPO</p> |
