CIRCUIT BOARD INSPECTION DEVICE, SENSOR SUBSTRATE FOR CIRCUIT BOARD INSPECTION DEVICE, AND CIRCUIT BOARD INSPECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board sensing device and others requiring no countermeasure for the stray capacity in a measuring place and capable of touchlessly inspecting any circuit board about existence or none of wire severance in a multi-layer circuit board in which wirings formed on the obverse and reverse surfaces of the circuit board are in electric continuity through an inner layer circuit wiring. SOLUTION: A first sensor substrate 10 having a plurality of first sensor electrodes 1-12 formed in stripes in the specified direction and a second sensor substrate 20 having a plurality of second sensor electrodes a-1 formed in stripes in the direction intersecting at a certain angle to the first sensor electrode are arranged on the two surfaces of the circuit board to be inspected, and one of the first sensor electrodes 1-12 and one of the second sensor electrodes a-1 are connected one by one to an electrostatic capacitance measuring part 30 by sensor electrode selecting means 11 and 21 so as to measure the electrostatic capacitance at each intersecting point of the first sensor electrodes 1-12 with the second sensor electrodes a-1, and on the basis of the measuring data obtained, judgement is made for acceptability of the circuit wirings formed on the circuit board. COPYRIGHT: (C)2004,JPO