| 摘要 |
PROBLEM TO BE SOLVED: To provide an end face type thermal head in which variation (distribution) in the thermal characteristics of a heat insulation layer can be suppressed and the number of thermal heads being produced per one substrate can be increased, and to provide its manufacturing process. SOLUTION: At first, a plurality of thin film modules H each comprising a glaze heat insulation layer 3, a resistive film 4 including a plurality of heating resistors 4a, a common electrode 5a connected with all heating resistors 4a, a plurality of discrete electrodes 5b connected with the heating resistors 4a individually, and a protective layer 6 are formed in parallel on the surface 2a' of a head substrate. The head substrate 2 is then cut in the direction parallel with the layer direction of the thin film module H to produce individual thin film modules H and then the common electrode 5a and the plurality of discrete electrodes 5b are exposed by grinding the cutting face. Thereafter, a common conductor 7a conducting to the common electrode 5a and a plurality of discrete conductors 7b conducting to the plurality of discrete electrodes 5b, respectively, are formed by thin film forming technology on the cut faces exposing the common electrode 5a and the plurality of discrete electrodes 5b thus obtaining the end face type thermal head 1. COPYRIGHT: (C)2004,JPO
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