| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board which can suppress wet spreading of a metal ink coating on the surface of a baked ceramic substrate body, which does not have capability of approaching or bringing into contact with adjacent unburned wirings with each other, which reduces an insulating resistance of wirings to each other after baking, and which does not further have capability of short-circuiting the wirings to each other. SOLUTION: The method for manufacturing the wiring board 100 includes a surface treating step of moistening a body surface 190b of baked ceramic substrate body 190 with aqueous solution 12 of a surfactant, a drying step of drying the surface 190b moistened with the solution 12, an unburned wiring layer forming step of forming an unburned wiring layer 130 by coating the surface 190b with the metal ink containing metal powder and a solvent, and a wiring layer forming step of forming a wiring layer 110 on the surface 190b by baking the layer 130. COPYRIGHT: (C)2004,JPO
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