CAP FOR CHIP COMPONENT, AND STRUCTURE FOR PACKAGING CHIP COMPONENT INTO PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain a cap for chip components for packaging a plurality of chip components into a pair of pads of a printed circuit board within a minimum area while complementing mechanical strength. SOLUTION: A cap 20 for chip components is composed of an electric insulating material and provided with a cover 2a for covering chip components 12 and 13, a leg 2b in surface-contact with a printed circuit board 11 used for adhesion therewith, and an opening 2c for exposing an electrode 13a of each chip component for easily performing electrical measurement. COPYRIGHT: (C)2004,JPO