| 发明名称 |
TREATMENT APPARATUS AND TREATMENT METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment apparatus and treatment method capable of shortening the time for switching gaseous raw materials by shortening the time required for evacuation of the gaseous raw materials and of maintaining the temperature on a substrate surface under treatment constant. SOLUTION: The treating gases containing gaseous raw materials (TiCl<SB>4</SB>and NH<SB>3</SB>) and inert gas (N<SB>2</SB>) are supplied into a treating vessel 2. The pressure in the treating vessel 2 is detected by a pressure gage 6 and the flow rate of the treating gases supplied into the treating vessel 2 is controlled in accordance with the result of the detection. Purging of the gaseous raw materials is performed by the inert gas. The flow rate as the entire part of the gaseous raw materials is controlled and the pressure in the treating vessel 2 is maintained constant by maintaining the flow rate of the treating gaseous raw material constant and by controlling the flow rate of the inert gas. COPYRIGHT: (C)2004,JPO
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| 申请公布号 |
JP2004091850(A) |
申请公布日期 |
2004.03.25 |
| 申请号 |
JP20020253674 |
申请日期 |
2002.08.30 |
| 申请人 |
TOKYO ELECTRON LTD |
发明人 |
KAWANAMI HIROSHI;ISHIZAKA TADAHIRO;KOJIMA YASUHIKO;OSHIMA YASUHIRO;SHIGEOKA TAKASHI |
| 分类号 |
C23C16/52;C23C16/34;C23C16/44;C23C16/455;H01L21/205;H01L21/285;H01L21/31;(IPC1-7):C23C16/52 |
主分类号 |
C23C16/52 |
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