发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive adhesive composition that can secure a desirable adhesive strength. SOLUTION: An amorphous silica powder with an average particle diameter of≤6μm is added to and blended with a thermosetting resin, or the powder is added to a powdery adhesive of a thermosetting resin with an average particle diameter of≤40μm for blending. An effect to obtain the inexpensive adhesive composition with a desirable adhesive strength, is thereby obtained. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004091733(A) 申请公布日期 2004.03.25
申请号 JP20020257866 申请日期 2002.09.03
申请人 DAIKEN TRADE & IND CO LTD 发明人 MORISHITA SHIGERU;YAMAWAKI TOSHIYUKI;MURAKAMI SATOSHI
分类号 C09J201/00;C09J11/04;(IPC1-7):C09J201/00 主分类号 C09J201/00
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