| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting board which can prevent filling defects of a sealing resin to the recessed parts formed between an insulating film and wiring electrodes. <P>SOLUTION: A mounting board comprises a substrate 1 having a first main surface, wiring electrodes 2 formed on the first main surface, and an insulating film 3 for partly covering the first main surface of the substrate 1 and the wiring electrodes 2. The covered part and uncovered opening parts 3a on the substrate and wiring electrodes with the insulating film are formed. An electronic component 10 is mounted via bump electrodes 11 which are arranged corresponding to the wiring electrodes 2 in the opening parts 3a, and a sealing resin 20 is filled in the clearance between the first main surface and the electronic component element. The opening part 3a is arranged approximately in the orthogonal direction to the longitudinal direction of the wiring electrodes 2, and the ratio of the minimum width L of the part where the substrate 1 is exposed in the opening part 3a to the thickness T of the insulating film 3 is set to be 2 or more. <P>COPYRIGHT: (C)2004,JPO |
