| 摘要 |
<P>PROBLEM TO BE SOLVED: To connect a silicon substrate and solder balls through conductive connection without effecting the bonding process when manufacturing a semiconductor device called as a BGA(ball grid array), for example. <P>SOLUTION: A lattice embedding member 34 is bonded onto a bonding layer above a base board 21 having a size coping with a plurality of semiconductor devices. Next, a semiconductor constituting body 23, provided on the silicon substrate 24 with a rewiring 31, a columnar electrode 32 and a sealing film 33, is bonded onto the bonding layer 22 in the opening of the embedding member 34. Next, a sealing film 36 is formed between the semiconductor constituting body 23 and a square frame embedding member 34 at the outside of the semiconductor constituting body 23. Next, a first upper layer insulating film 37, a first upper layer rewiring 39, a second upper layer insulating film 41, a second upper layer rewiring 43 and a third upper layer insulating film 44 are formed in the form of lamination and subsequently solder balls 46 are formed. Next, when the mutually neighbored semiconductor constituting body 23 is cut along a boundary line between the constituting bodies, a plurality of semiconductor devices equipped with the solder balls 46 are obtained. <P>COPYRIGHT: (C)2004,JPO |
