| 发明名称 |
LEAD FRAME, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the molding yield of a resin-sealed semiconductor device, by reducing the bubbles in the package of the resin-sealed semiconductor device, by simplifying the structure of its die, and by dispensing with the removal of burrs when using the die repeatedly. <P>SOLUTION: A lead frame having a tab 1 for mounting thereon a semiconductor chip in its central portion and having inner lead portions 2a arranged in the peripheral portion of the tab 1 is provided with air-exhaust-oriented grooves for exhausting the air in a die when sealing the lead frame by injecting a sealant into the molding die in the predetermined positions of the tie-bar regions of the rear or front surface of the lead frame 10 wherein the inner leads are arranged. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004096022(A) |
申请公布日期 |
2004.03.25 |
| 申请号 |
JP20020258348 |
申请日期 |
2002.09.04 |
| 申请人 |
RENESAS TECHNOLOGY CORP;HITACHI ULSI SYSTEMS CO LTD;HITACHI TOKYO ELECTRONICS CO LTD |
发明人 |
ITO FUJIO;SUZUKI HIROMICHI;KAMEOKA AKIHIKO;TAKENO HIROYUKI;SHIMOJI HIROSHI;MURAKAMI FUMIO |
| 分类号 |
H01L21/56;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L21/56 |
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