| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board facilitated in the management of the quality, the history or the like and the managing method of the history or the like in various kinds of products including the multilayer wiring board. <P>SOLUTION: The multilayer wiring board provided with built-up layers on both sides of a core substrate and a required indication for management, which is provided at a predetermined site on the core board employing infrared ray absorbing ink, or provided with the required indication for management, which is provided at a predetermined site on the built-up layer employing fluorescent ink. <P>COPYRIGHT: (C)2004,JPO</p> |
