| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a slit plate by forming a metal slit plate on a conductive base material, and thereafter removing the base material. SOLUTION: A first resist layer is fitted to a position which does not correspond to a slit plate on a conductive base material. Metal is raised so as to cover a face which is not covered with the resist on the conductive base material and also so as to be made higher than the first resist layer lying at the slit formation position by an electroforming method. The metal on the base material and the resist layer are covered with an another second resist layer. Then, masking is performed so as to prevent the exposure of the region including the slit formation position, and the second resist layer is exposed, so that, only in the region including the slit formation position, the second resist layer is removed, and the metal is subjected to etching to the height of the first resist layer lying at the slit formation position or below to remove the base material and the first resist from the metal. Thus, the metal slit plate is produced. COPYRIGHT: (C)2004,JPO
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