发明名称 HEAT-SENSITIVE ADHESIVE COMPOSITION AND HEAT-SENSITIVE ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a heat-sensitive adhesive composition exhibiting a gelatinous state free from adhesivity at or below normal temperature and having adhesivity after heating at or above a prescribed temperature without forming gel even at normal temperature. SOLUTION: The heat-sensitive adhesive composition is composed of (a) a gelling agent composed of an optically active amino acid derivative expressed by general formula (I) and (b) a thermoplastic resin having a glass transition temperature of≤-20°C. In the formula (I), R<SB>1</SB>is a 1-7C alkyl or benzyl; (n) is 1 or 2; R<SB>2</SB>is an 8-30C alkyl or an alkylaryl composed of an aryl group having a 6-24C alkyl group when (n) is 1 and R<SB>2</SB>is a 4-30C alkylene when (n) is 2; and X is a protective group of an amino group. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004091705(A) 申请公布日期 2004.03.25
申请号 JP20020256866 申请日期 2002.09.02
申请人 NITTO DENKO CORP 发明人 SATSUMA MICHIO
分类号 B32B7/12;C09J7/02;C09J11/06;C09J201/00;C09K3/00;(IPC1-7):C09J201/00 主分类号 B32B7/12
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