Electrically conducting connection used in the production of a circuit board comprises forming a contact surface on a pin and/or bushing through a soft electrically conducting metallic external layer applied on a diffusion barrier layer

摘要

Electrically conducting connection between a pressing pin (8) and a bushing (6) comprises forming a contact surface between the pin and bushing by plastic deformation. The contact surface is formed on the pin and/or bushing through a soft electrically conducting metallic external layer (13) applied on a diffusion barrier layer (11). The external layer has a thickness of 0.1-0.8 micronsm, preferably up to 6 micronsm.