| 摘要 |
On a die that has etchings on a surface, firstly a sheet of negative photoresist is laid down which, by means of an exposure and subsequent development, is left only above the etchings; then, upon the negative photoresist, a positive photoresist is applied, which is subjected to exposu re and development to produce functional geometries deposited in thin film; subsequently the positive photoresist is removed in a ~lift-off~ operation, and the negative photoresist is taken off in a plasma operation, thus revealing the etchings.
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