| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein a semiconductor element sealing resin body is shaped with high precision as prescribed without incurring additional manufacturing costs or man-hours. <P>SOLUTION: In this method for manufacturing a resin-sealed light emitting diode 21 comprising a mounting process for mounting a light emitting element 24 on a substrate 22 and a sealing process for sealing the mounted light emitting element 24 in a resin material, a sealing body 26 formed in the sealing process is shaped as prescribed by using a blade 29 capable of scanning and controlling the sealing body 26 along its X-axis, Y-axis, and Z-axis. <P>COPYRIGHT: (C)2004,JPO |
