| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging method and structure that enable a reduction in distance between the chip components and finely mount small chip components. <P>SOLUTION: In this packaging method, when mounting a plurality of chip components 4, 5, and 4' whose sides are aslant to the upper surfaces on a mounting substrate 2 by arranging them with their slanted sides facing one another, their facing sides are made approximately parallel to mount. In this packaging structure has the chip components 4, 5, and 4' with their sides aslant to the upper surfaces are mounted on the substrate 2 with their sides facing one another keeping their facing sides parallel. <P>COPYRIGHT: (C)2004,JPO |
