| 摘要 |
PROBLEM TO BE SOLVED: To shorten a resin flow path in a process of mounting a semiconductor wafer into a mold and resin-sealing the surface of the wafer. SOLUTION: A pot 204 to apply the resin is located in a lower mold 200, and the semiconductor wafer 210 is mounted on the lower mold 200 so that the nearly central portion of the semiconductor wafer 210 corresponds to the pot 204. The resin is applied from the nearly central portion of the semiconductor wafer 210 to the surrounding part. COPYRIGHT: (C)2004,JPO
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