| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily maintain sensor characteristics and at the same time, to surely prevent damage at a thin section in a microsensor that is made of silicon, and has a sensor element in a diaphragm structure. SOLUTION: A recess 42 with a prescribed depth is formed on a bottom surface 41B of a recess 41 for bonding of a gas sensor 10. The recess 42 is set as a sealed state, when the sensor element 50 is bonded to the recess 41 for bonding via a sheet-like bonding member 48. COPYRIGHT: (C)2004,JPO
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