| 摘要 |
PROBLEM TO BE SOLVED: To obtain high soldering reliability in a process for mounting a solder ball, semiconductor chips, a semiconductor package and the like by reflow soldering using a hardenable flux. SOLUTION: The hardenable flux used in soldering and in reinforcing a solder joint has a viscosity not below 1.0×10<SP>-2</SP>Pa s and not above 5.0×10<SP>-2</SP>Pa s in the temperature range from 30°C to solder melting point. In addition, it is desirable that the hardenable flux contains epoxy resin having two or more epoxy radicals, and a hardener having at least two or more phenolic hydroxyl groups per molecule and at least one or more carboxyl groups per molecule. COPYRIGHT: (C)2004,JPO
|
