| 摘要 |
<P>PROBLEM TO BE SOLVED: To eliminate defect caused by deviation and warpage of a substrate mounted on a lower conductor plate in a high-frequency circuit device, using a dielectric waveguide. <P>SOLUTION: A dielectric strip and a dielectric film are integrally formed by printing on a lower conductor plate. An electronic component is mounted on electrodes provided on the dielectric film. Further, with the provision of a concave and a convex on the portions of the lower conductor plate having the dielectric film formed thereon, the adhesiveness between the lower conductor plate and the dielectric film is enhanced. <P>COPYRIGHT: (C)2004,JPO |
