发明名称 MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring board in which the layer connection is surely achieved, reliability is improved and an outer layer wiring board is laminated. <P>SOLUTION: The multilayer flexible wiring board has a single-sided wiring board which has a wiring pattern, and a conductor double-layer post composed of a copper layer and a metal layer or composed of the copper layer and an alloy layer protruded from the wiring pattern to one side of a supporting base material composed of an insulator opposite to the wiring pattern on one side of the supporting base material. The thickness of the metal layer or the alloy layer is≥2μm. The flexible board is a single-sided wiring board cut into a size required for a multilayer part, a flexible wiring board composed of a wiring pattern having a pad for the connection with the conductor double-layer post on one side at least, and an adhesive layer with a flux function. Then, the single-sided wiring board and the flexible wiring board are adhered via the adhesive layer with the flux function, and the conductor double-layer post and the pad are bonded with metal or alloy. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004095695(A) 申请公布日期 2004.03.25
申请号 JP20020252252 申请日期 2002.08.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 CHUMA TOSHIAKI;KATO MASAAKI;KONDO MASAYOSHI;NAKAO SATORU;FUJIURA KENTARO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址