| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having an excellent heat dissipation property although it is simplified in its structure and is easily manufactured. SOLUTION: The semiconductor device comprises a semiconductor element, a supporter fixed to one surface of the semiconductor element, a heat dissipation section provided on the other surface of the semiconductor element, and a sealing resin for sealing the semiconductor element. The heat dissipation section is provided on the surface, on which electrodes of the semiconductor element is formed, so as to remove the electrodes. COPYRIGHT: (C)2004,JPO
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