| 摘要 |
The sensor arrangement (11) includes a second thermal source (36b), second medium and second fastening (35b). The second thermal source is thermally coupled with the second medium via a third thermal coupling. The second thermal source is connected to the second fastening. Between second thermal source and second fastening is a fourth thermal coupling. First and the third thermal couplings differ. Preferred Features: Second and fourth thermal couplings are the same. First heat source (36a) and first fastening are monolithically integrated in a first substrate, especially manufactured in micromechanical technology. Second heat source and second fastening are monolithically integrated in a second substrate, similarly manufactured. First and second substrates are monolithically integrated. First and second heat sources are included in a single membrane layer. Strips form the first and second fastenings, have comparatively low thermal conductivity, and are made of SiO2 or silicon nitride. An Independent claim is included for the corresponding method of measurement.
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