| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability in a mounting part of a printed circuit board and a flexible printed board, by having an adhesive element contain conductive particles coated with an insulating film. SOLUTION: Concerning the adhesive element for an electronic component such as an IC chip and a mounting board, a filler, for instance, conductive particles coated with an insulating film with a particle size within a range of 0.1 to 1.0μm, such as nickel particulates coated with a nickel oxide film is contained in an NCF (Non-Conductive Film), for instance, an adhesive with an epoxy thermosetting resin as the main material. Therefore, the fine particle size can cope with recent needs for a finer-pitched adhesive element for the IC chip and the mounting board. COPYRIGHT: (C)2004,JPO
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