发明名称 Dual trench isolation using single critical lithographic patterning
摘要 A method and apparatus for forming shallow and deep isolation trenches in a substrate so that the shallow and deep isolation trenches are aligned without mis-registration. The method includes forming a plurality of shallow trenches, covering a portion of the plurality of shallow trenches, then etching the uncovered shallow trenches to create deeper trenches.
申请公布号 US2004058508(A1) 申请公布日期 2004.03.25
申请号 US20030669825 申请日期 2003.09.23
申请人 PARAT KRISHNA;PANGAL KIRAN;LU ALLEN 发明人 PARAT KRISHNA;PANGAL KIRAN;LU ALLEN
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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