| 发明名称 |
System and method for heating and cooling wafer at accelerated rates |
| 摘要 |
A highly dynamic heating and/or chilling chamber for processing semiconductor wafers. The chamber has uniform heat and gas flow distribution in order to minimize the temperature gradient at different points of the wafer.
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| 申请公布号 |
US2004056017(A1) |
申请公布日期 |
2004.03.25 |
| 申请号 |
US20030619731 |
申请日期 |
2003.07.15 |
| 申请人 |
RENKEN WAYNE GLENN |
发明人 |
RENKEN WAYNE GLENN |
| 分类号 |
H01L21/027;H01L21/00;(IPC1-7):H05B3/68 |
主分类号 |
H01L21/027 |
| 代理机构 |
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