| 发明名称 |
Wärmehärtbare Harzzusammensetzung |
| 摘要 |
<p>A thermosetting resin composition for a fixing treatment of electronic parts, which is able to adhere in short time at low temperature, has a heat resistance, is lowly hygroscopic, and hardly produces package cracks, etc. The thermosetting resin composition comprises polycarbodiimide which is soluble in organic solvents and silicone-modified polyimide which is soluble in organic solvents, which are compounded.</p> |
| 申请公布号 |
DE69821664(D1) |
申请公布日期 |
2004.03.25 |
| 申请号 |
DE1998621664 |
申请日期 |
1998.04.01 |
| 申请人 |
NITTO DENKO CORP., IBARAKI |
发明人 |
SAKAMOTO, MICHIE;MOCHIZUKI, AMANE;YOSHIOKA, MASAHIRO;HOTTA, YUJI |
| 分类号 |
C08J5/18;B32B27/34;C08G73/00;C08G73/10;C08L79/00;C08L79/08;C09J7/02;C09J179/00;C09J179/08;(IPC1-7):C08L79/08 |
主分类号 |
C08J5/18 |
| 代理机构 |
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