| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device for preventing polishing unevenness of circular arc shape formed on the outer peripheral part of a substrate after polishing work in a single-side polishing process for polishing the surface of a plate body such as the glass substrate or a wafer. <P>SOLUTION: A back pad 1 formed of a foam sheet made of porous resin is used for the single-side polishing device for polishing the surface of the substrate 2 by pressing the substrate 2 held by the back pad 1, to a rotated polishing machine and abrasive cloth by a pressure lap. In this case, the back pad 1 of 0.4 to 0.8 mm in thickness and 0.2 to 2.8 mg/cm<SP>2</SP>in surface water absorption from the substrate holding face of the back pad 1 is used for polishing work. <P>COPYRIGHT: (C)2004,JPO |
