发明名称 PACKAGE OF MICROORGANISM-IMMOBILIZING CARRIER CHIP
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a package of microorganism-immobilizing carrier chips capable of sinking the carrier chips made of soft urethane foam in water in a short time and having good transport efficiency and housing efficiency. <P>SOLUTION: A large number of the microorganism-immobilizing carrier chips 2 made of the soft urethane foam are housed in a housing bag 1 partially or entirely using a water soluble synthetic resin to be packaged in a compressed state. The density of the formed package is preferably 1 g/cm<SP>2</SP>or more. The housing bag 1 may be made of a reticulated matter or a punched film. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004089803(A) 申请公布日期 2004.03.25
申请号 JP20020252478 申请日期 2002.08.30
申请人 ACHILLES CORP 发明人 YOSHIDA TAKASHI
分类号 B65D65/46;C02F3/10;(IPC1-7):C02F3/10 主分类号 B65D65/46
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