METHOD FOR CONNECTING SUBSTRATE, CONNECTION STRUCTURE OF SUBSTRATE, THERMOCOMPRESSION BONDING DEVICE, MANUFACTURING METHOD FOR ELECTRO-OPTICAL DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for connecting a rigid substrate and a flexible substrate by thermocompression bonding while preventing the positional shift of a terminal due to the expansion of the flexible substrate, a connection structure of substrate, a device, a manufacturing method for an electro-optical device, an electro-optical device, and an electronic apparatus. SOLUTION: When the flexible substrate 90 is thermocompression-bonded to the rigid substrate 20, a resin basic material 94 of the heated flexible substrate 90 expands as shown by an arrow W as compared with the rigid substrate 20. The flexible substrate 90 is pressed against the rigid substrate 20 by means of a head 220, and then an anisotropic conductive material 80 is heated by supplying power to a heater 221. COPYRIGHT: (C)2004,JPO