发明名称 |
Manufacturing method of circuit substrate, circuit substrate and manufacturing device of circuit substrate |
摘要 |
A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 mum to 100 mum and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.
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申请公布号 |
US2004059455(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20030668777 |
申请日期 |
2003.09.22 |
申请人 |
KONICA MINOLTA HOLDINGS, INC.;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE |
发明人 |
KAWAHARA YUUSUKE;YOSHIDA TETSUYA;MURATA KAZUHIRO;YOKOYAMA HIROSHI |
分类号 |
B05D5/12;B05C5/00;B05C9/14;B05D7/00;H01L21/00;H05K3/10;H05K3/12;(IPC1-7):G06F19/00 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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