发明名称 |
Processing method for forming thick film having improved adhesion to surface-modified substrate and apparatus thereof |
摘要 |
Disclosed is a processing method for forming a thick film having an improved adhesion to a surface-modified substrate and an apparatus thereof enabling to form a thick film having the improved adhesion to a polymeric surface by modifying the polymeric surface to have a hydrophilic property. The method includes the steps of preparing a substrate of a polymer material, surface-modifying the substrate, forming a seed layer on the substrate, and forming the thick film on the seed layer. The apparatus includes an unloading area supplying a substrate of a polymer material, a surface treating area modifying a surface of the substrate, a seed layer formation area forming a seed layer on the surface-modified substrate, a thick film formation area forming a thick film on the seed layer, and a loading area loading the substrate.
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申请公布号 |
US2004058088(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20030651956 |
申请日期 |
2003.09.02 |
申请人 |
BEAG YOUNG-WHOAN;HAN SUNG;CHO JUN-SIK;LEE CHEOL-SU;KOH SUNG-SOO;SEOK JIN-WOO |
发明人 |
BEAG YOUNG-WHOAN;HAN SUNG;CHO JUN-SIK;LEE CHEOL-SU;KOH SUNG-SOO;SEOK JIN-WOO |
分类号 |
C23C14/02;C23C14/20;C23C14/56;C23C18/20;C25D5/56;H05K3/38;(IPC1-7):C23C14/12;C23C14/34;C23C14/35;C23C14/46;C23C16/00;C23C28/00;C25D5/54;C25D17/00;H05H1/00 |
主分类号 |
C23C14/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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