JET SINGULATION OF A SUBSTRATE

摘要

Techniques for singulating a substrate (12) into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream (11) in order to cut through large components (12) so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.