| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with built-in circuit components having excellent characteristics and dielectric strength. <P>SOLUTION: An aperture 8a to which a capacitor is provided is formed to a prepreg sheet 8, the prepreg sheet 8 is stacked on a core sheet 1 to provide the capacitor within the aperture 8a, and a protection sheet 9 is stacked thereon. At the internal surface of the protection sheet 9, a bump 10 is previously formed and a circuit 11 is formed at the external surface. The bump 10 and the circuit 11 are connected through a conductor 13 embedded within a via hole 12. Such stacked material is heated to 200°C. Accordingly, the prepreg sheet 8 is fused and the resin diffused to the gap (aperture) is hardened. <P>COPYRIGHT: (C)2004,JPO</p> |
