| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip by which a time required for manufacturing it can be shortened and high integration and yield be improved, and a semiconductor chip using the same. SOLUTION: A semiconductor chip manufacturing device is used to apply isotropic etching to a cut part in a semiconductor wafer 100 to form grooves 110 and 130, as well as anisotropic etching thereto to form a groove 130. When the grooves 110, 120 and 130 are formed, the semiconductor wafer 100 is cut, and a semiconductor chip having a notched shape whose outer edge is not at a right angle. COPYRIGHT: (C)2004,JPO |
