| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a module structure, which can reduce appropriately the size and space and, in addition, can appropriately realize a high heat radiating property, and to provide a method of fixing a circuit board and a ceramic circuit board. SOLUTION: In the method of fixing the ceramic circuit board to a heat radiating member, a ceramic circuit board having notched sections is used and the surface of the circuit board in contact with the heat radiating member is adhered closely to the member by deforming the notched sections by adding forces to the notched sections. COPYRIGHT: (C)2004,JPO |
