RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition which has excellent storage stability and is used for sealing semiconductors, and to realize a semiconductor device using the resin composition and having excellent reliability at a low cost. SOLUTION: This resin composition for sealing semiconductors and comprising an epoxy resin, a curing agent, a curing accelerator and an inorganic filler is characterized by using a phosphine compound coated with and/or dispersed in a phenol compound novolac as the curing accelerator. The resin composition which is used for sealing the semiconductors and uses as the curing accelerator the phosphine compound coated with and/or dispersed in the phenol compound novolac has excellent storage stability and hardly changes thermal curability and flowability on molding, also after stored for a long period. COPYRIGHT: (C)2004,JPO