SUBSTRATE SURFACE TREATMENT METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To solve the problem of deterioration and a short circuit of wiring caused by ion migration due to further decrease of pitch between electrodes formed on an IC chip along with high integration of a circuit within the IC ship. SOLUTION: High-frequency waves of 100 W (power density of 0.32 W/cm2) are applied to a high frequency electrode 16 while vacuum degree in a reaction chamber 12 is maintained at 120 Pa to generate CF4gas plasma. A module substrate 15 is treated with the generated CF4gas plasma to form a fluorine-containing film efficiently. A surface of the module substrate 15 is coated with the a fluorine-containing film, thus corrosion of gold or copper wiring and the ion migration between substrate electrodes 9 of an FPC 2 are prevented. COPYRIGHT: (C)2004,JPO