发明名称 |
Thermally enhanced lid for multichip modules |
摘要 |
An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
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申请公布号 |
US2004057214(A1) |
申请公布日期 |
2004.03.25 |
申请号 |
US20030665669 |
申请日期 |
2003.09.18 |
申请人 |
ALCOE DAVID J.;BRODSKY WILLIAM L.;CALMIDI VARAPRASAD V.;SATHE SANJEEV B.;STUTZMAN RANDALL J. |
发明人 |
ALCOE DAVID J.;BRODSKY WILLIAM L.;CALMIDI VARAPRASAD V.;SATHE SANJEEV B.;STUTZMAN RANDALL J. |
分类号 |
H05K7/20;H01L23/10;H01L23/36;H01L23/40;H01L23/42;H01L23/427;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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