Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition

摘要

A semiconductor element is mounted on a wiring circuit board in which a circuit has been formed. This semiconductor element is resin-encapsulated with a first encapsulating resin layer. Then, a second encapsulating resin layer is formed, on the outer circumference of the first encapsulating resin layer, from an epoxy resin composition containing the following components (A) to (D): (A)epoxy resin; (B)phenolic resin; (C)curing accelerator; and (D)at least one of the following particles (d1) and (d2): (d1) conductive particles whose surfaces are subjected to coating treatment with an insulating inorganic material; and (d2) magnetic particles whose surfaces are subjected to coating treatment with an insulating inorganic material.