WAFER SIDE RINSE APPARATUS OF SEMICONDUCTOR COATING EQUIPMENT

摘要

PURPOSE: A wafer side rinse apparatus of semiconductor coating equipment is provided to prevent an error of a wafer process by using a nozzle detection sensor to sense a bending state of an injection nozzle. CONSTITUTION: A wafer side rinse apparatus of semiconductor coating equipment includes an injection nozzle(6) and a nozzle detection sensor(9). The injection nozzle(6) is used for injecting the rinsing solution. The nozzle detection sensor(9) is installed at both sides of the injection nozzle(6) in order to sense a bending state of the injection nozzle(6). The apparatus for rinsing a side of a wafer in semiconductor coating equipment includes a control unit(8) for stopping an operation when the bending state of the injection nozzle is detected by the nozzle detection sensor(9).