| 摘要 |
PURPOSE: An electroplating apparatus is provided in which hydrogen gas removing means is installed to physically remove hydrogen gas generated on the surface of an object to be plated during electroplating, and an electroplating method using the same is provided. CONSTITUTION: In an electroplating apparatus(1) comprising a plating pot(3) which is equipped with anode electrodes(11a,11b) and stationary stand(14), and in which electrolyte(2) is contained, wherein the stationary stand stations racks(3) to which objects to be processed(12) are supported; and a power supply part for supplying power source to the plating pot, the electroplating apparatus comprises a hydrogen gas removing means(20) for sending a plurality of fine air bubbles to the object to be processed from a lower part of the plating pot to remove hydrogen gas generated on the plating surface of the object to be processed during electrolysis reaction, and the hydrogen gas removing means comprises a blower(22) installed at an outer side of the plating pot; and a bubble discharge part(24) connected to the blower by pipeline(23) and positioned under the plating pot so that the bubble discharge part discharges air bubbles through a plural pores(24a,24b) formed at the bubble discharge part itself, wherein at least one or more plies of microfiber(25) are surroundingly fixed to the outer circumferential surface of the bubble discharge part to micronize size of bubbles coming out of the plural pores.
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