发明名称 |
Integrated optical chip |
摘要 |
<p>An integrated optical chip has a crystalline structure cut along parallel principle crystallographic planes and a thickness of less than 1.0mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane (13) is disposed between the chip (33) and substrate (35) to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described. <IMAGE></p> |
申请公布号 |
EP1400820(A1) |
申请公布日期 |
2004.03.24 |
申请号 |
EP20020078898 |
申请日期 |
2002.09.20 |
申请人 |
CORNING O.T.I. SRL |
发明人 |
GOBBI, LUIGI;MARAZZI, MARCO;OBETTI, GLORIA;CACCAVALE, FEDERICO |
分类号 |
G02B6/132;G02F1/035;(IPC1-7):G02B6/12 |
主分类号 |
G02B6/132 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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